MCM Flip-chip-bonding Technique Used in Fabrication of CMOS-S EED Smart Pixel by Zhao Yong.
CMOS-SEED smart pixel and related M CM flip-chip-bonding technique is introduced.Using magnetic sputter vacuum v aporation method with thick photoresist as mask,In-bump array manufacture,flip -chip-bonding process,fullfill between chips removing or thinning of the s ubstrate for sub-chip was presented.
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